Semiconductor device structure with a fine pattern and method for forming the same

ABSTRACT

The present application discloses a semiconductor device structure and a method for forming the same. The method includes forming a pillar over a substrate, forming a first ring structure over a sidewall of the pillar, removing the pillar to form a first opening surrounded by the first ring structure, forming a second ring structure in the first opening, forming a third ring structure surrounding the first ring structure after the first opening is formed, and removing the first ring structure to form a gap between the second and third ring structures. A semiconductor device structure includes a dielectric layer over a substrate, a first ring structure over the dielectric layer, and a second ring structure over the dielectric layer and surrounding the first ring structure, wherein the first and the second ring structures have a first common center.

TECHNICAL FIELD

The present disclosure relates to a semiconductor device structure and a method for forming the same, and more particularly, to a semiconductor device structure with a fine pattern and a method for forming the same.

DISCUSSION OF THE BACKGROUND

As semiconductor device structures become smaller and more highly integrated, a number of technologies for fabricating fine patterns for semiconductor device structures have been developed. Particularly, a photolithography process is typically used to fabricate electronic and optoelectronic devices on a substrate, and photoresist patterns prepared by the photolithography process are used as masks in etching or ion implantation processes. As the required pitch size and critical dimension (CD) continue to shrink, the fineness of the photoresist patterns becomes a very important factor in the degree of integration. However, photolithographic processes for fabricating semiconductor features present a limitation to continued increases in resolution of the exposure apparatus.

Although existing semiconductor device structures with fine patterns and methods for manufacturing the same have been adequate for their intended purposes, they have not been entirely satisfactory in all respects. Therefore, at the present time, there are still some problems to be overcome in regards to the technologies of forming semiconductor device structures with fine patterns by photolithography process.

This Discussion of the Background section is provided for background information only. The statements in this Discussion of the Background are not an admission that the subject matter disclosed in this section constitutes prior art to the present disclosure, and no part of this Discussion of the Background section may be used as an admission that any part of this application, including this Discussion of the Background section, constitutes prior art to the present disclosure.

SUMMARY

In one embodiment of the present disclosure, a method for forming a semiconductor device structure is provided. The method includes forming a pillar over a substrate, and forming a first ring structure over a sidewall of the pillar. The method also includes removing the pillar to form a first opening surrounded by the first ring structure, and forming a second ring structure in the first opening. The method further includes forming a third ring structure surrounding the first ring structure after the first opening is formed, and removing the first ring structure to form a gap between the second ring structure and the third ring structure.

In some embodiments, the first ring structure is in direct contact with the second ring structure, and a width of the first ring structure is substantially the same as a width of the second ring structure.

In some embodiments, the first ring structure is in direct contact with the third ring structure, the second ring structure and the third ring structure are simultaneously formed, and a width of the second ring structure is substantially the same as a width of the third ring structure.

In some embodiments, a width of the pillar is greater than about three times a width of the first ring structure.

In some embodiments, the method further comprises: forming a dielectric layer over a top surface of the substrate and a top surface of the first ring structure before the second ring structure and the third ring structure are formed, wherein a top surface of the dielectric layer is higher than top surfaces of the second ring structure and the third ring structure before the first ring structure is removed.

In some embodiments, the second ring structure and the third ring structure are formed over the dielectric layer, and a material of the dielectric layer is different from a material of the second ring structure and a material of the third ring structure.

In some embodiments, a second opening is formed in the first opening after the second ring structure is formed, the second opening is surrounded by the second ring structure, and a width of the first ring structure is substantially the same as a width of the second opening.

In another embodiment of the present disclosure, a method for forming a semiconductor device structure is provided. The method includes forming a first pillar over a substrate, and forming a first ring structure surrounding the first pillar. A width of the first pillar is greater than a width of the first ring structure. The method also includes removing the first pillar after the first ring structure is formed, and forming a dielectric layer over a top surface of the substrate after the first pillar is removed. The method further includes forming a second ring structure and a third ring structure over the dielectric layer. The second ring structure is surrounded by the first ring structure, and the second ring structure is surrounded by the third ring structure. In addition, the method includes removing the first ring structure and a portion of the dielectric layer left uncovered by the second ring structure and the third ring structure.

In some embodiments, a portion of the dielectric layer is formed over the first ring structure, and a top surface of the portion of the dielectric layer is higher than a top surface of the second ring structure and a top surface of the third ring structure.

In some embodiments, the second ring structure is in direct contact with an inner sidewall of the first ring structure, and the third ring structure is in direct contact with an outer sidewall of the first ring structure.

In some embodiments, the second ring structure and the third ring structure are separated by substantially the same distance.

In some embodiments, bottom surfaces of the second ring structure and the third ring structure are higher than a bottom surface of the first ring structure.

In some embodiments, the method further comprises: forming a second pillar over the substrate; forming a fourth ring structure surrounding the second pillar; removing the second pillar; and forming a fifth ring structure lining an inner wall of the fourth ring structure and a sixth ring structure surrounding the fourth ring structure, wherein a distance between the third ring structure and the sixth ring structure is substantially the same as a width of the first ring structure and a width of the third ring structure.

In one embodiment of the present disclosure, a semiconductor device structure is provided. The semiconductor device structure includes a substrate, and a dielectric layer disposed over the substrate. The semiconductor device structure also includes a first ring structure disposed over the dielectric layer, and a second ring structure disposed over the dielectric layer and surrounding the first ring structure. The first ring structure and the second ring structure have a first common center. The first opening surrounded by the first ring structure has a width in a cross-sectional view, and the width is substantially the same as a distance between the first ring structure and the second ring structure in the cross-sectional view.

In some embodiments, the width of the first opening is substantially the same as a width of the first ring structure in the cross-sectional view.

In some embodiments, the width of the first ring structure is substantially the same as a width of the second ring structure in the cross-sectional view.

In some embodiments, a top surface of the substrate is exposed by the first opening.

In some embodiments, the dielectric layer is made of a first material, the first ring structure and the second ring structure are made of a second material, and the first material is different from the second material.

In some embodiments, the first ring structure and the second ring structure have similar shapes in a top view, and the first opening is circular or rectangular with rounded corners in the top view.

In some embodiments, the semiconductor device structure further comprises: a third ring structure disposed over the dielectric layer; and a fourth ring structure disposed over the dielectric layer and surrounding the third ring structure, wherein the third ring structure and the fourth ring structure have a second common center, and wherein a distance between the fourth ring structure and the second ring structure is substantially the same as the distance between the first ring structure and the second ring structure in the cross-sectional view.

Methods for forming a semiconductor device structure are provided in accordance with some embodiments of the disclosure. The method for forming the semiconductor device structure may include forming a first ring structure over a sidewall of a pillar, removing the pillar to form a first opening, forming a second ring structure in the first opening, forming a third ring structure surrounding the first ring structure, and removing the first ring structure to form a gap between the second ring structure and the third ring structure. As a result, the second ring structure is surrounded by the third ring structure, and the second ring structure is separated from the third ring structure by the gap. Therefore, the semiconductor device structure having a finer pattern over the substrate can be obtained.

The foregoing has outlined rather broadly the features and technical advantages of the present disclosure in order that the detailed description of the disclosure that follows may be better understood. Additional features and advantages of the disclosure will be described hereinafter, and form the subject of the claims of the disclosure. It should be appreciated by those skilled in the art that the conception and specific embodiment disclosed may be readily utilized as a basis for modifying or designing other structures or processes for carrying out the same purposes of the present disclosure. It should also be realized by those skilled in the art that such equivalent constructions do not depart from the spirit and scope of the disclosure as set forth in the appended claims.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the following detailed description when read with the accompanying figures. It should be noted that, in accordance with the standard practice in the industry, various features are not drawn to scale. In fact, the dimensions of the various features may be arbitrarily increased or reduced for clarity of discussion.

FIG. 1 is a flow diagram illustrating a method of forming a semiconductor device structure, in accordance with some embodiments.

FIG. 2 is a top view illustrating an intermediate stage of forming a semiconductor device structure, in accordance with some embodiments.

FIG. 3 is a cross-sectional view illustrating an intermediate stage of forming a semiconductor device structure, taken along a sectional line I-I′ in FIG. 2, in accordance with some embodiments.

FIG. 4 is a top view illustrating an intermediate stage of forming a semiconductor device structure, in accordance with some embodiments.

FIG. 5 is a cross-sectional view illustrating an intermediate stage of forming a semiconductor device structure, taken along a sectional line I-I′ in FIG. 4, in accordance with some embodiments.

FIG. 6 is a top view illustrating an intermediate stage of forming a semiconductor device structure, in accordance with some embodiments.

FIG. 7 is a cross-sectional view illustrating an intermediate stage of forming a semiconductor device structure, taken along a sectional line I-I′ in FIG. 6, in accordance with some embodiments.

FIG. 8 is a top view illustrating an intermediate stage of forming a semiconductor device structure, in accordance with some embodiments.

FIG. 9 is a cross-sectional view illustrating an intermediate stage of forming a semiconductor device structure, taken along a sectional line I-I′ in FIG. 8, in accordance with some embodiments.

FIG. 10 is a top view illustrating an intermediate stage of forming a semiconductor device structure, in accordance with some embodiments.

FIG. 11 is a cross-sectional view illustrating an intermediate stage of forming a semiconductor device structure, taken along a sectional line I-I′ in FIG. 10, in accordance with some embodiments.

FIG. 12 is a top view illustrating a semiconductor device structure, in accordance with some embodiments.

FIG. 13 is a cross-sectional view illustrating a semiconductor device structure, taken along a sectional line I-I′ in FIG. 12, in accordance with some embodiments.

FIG. 14 is a top view illustrating a semiconductor device structure, in accordance with some embodiments.

DETAILED DESCRIPTION

The following disclosure provides many different embodiments, or examples, for implementing different features of the provided subject matter. Specific examples of components and arrangements are described below to simplify the present disclosure. These are, of course, merely examples and are not intended to be limiting. For example, the formation of a first feature over or on a second feature in the description that follows may include embodiments in which the first and second features are formed in direct contact, and may also include embodiments in which additional features may be formed between the first and second features, such that the first and second features may not be in direct contact. In addition, the present disclosure may repeat reference numerals and/or letters in the various examples. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed.

Further, spatially relative terms, such as “beneath,” “below,” “lower,” “above,” “upper” and the like, may be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. The spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The apparatus may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein may likewise be interpreted accordingly.

FIG. 1 is a flow diagram illustrating a method 10 for forming a semiconductor device structure, in accordance with some embodiments. The method 10 includes steps S11, S12, S13, S14, S15, and S16.

The steps S11 to S16 of FIG. 1 are first introduced briefly and then elaborated in connection with FIGS. 2 to 14. At step S11, a pillar is formed over a substrate. In some embodiments, more than one pillar is formed over the substrate, and each pair of the pillars are separated by a distance. At step S12, a first ring structure is formed surrounding the pillar. In some embodiments, the first ring structure is in direct contact with the pillar, and sidewalls of the pillar are entirely surrounded by the first ring structure. At step S13, the pillar is removed. In some embodiments, the pillar is removed to form an opening entirely surrounded by the first ring structure.

Still referring to FIG. 1, at step S14, a dielectric layer is formed over the substrate and the first ring structure. In some embodiments, a top surface of the substrate and a top surface of the first ring structure are covered by the dielectric layer. At step S15, a second ring structure and a third ring structure are formed over the dielectric layer. In some embodiments, the second ring structure is entirely surrounded by the first ring structure, and the first ring structure is entirely surrounded by the third ring structure. At step S16, the first ring structure and a portion of the dielectric layer are removed. In some embodiments, a portion of the dielectric layer not covered by the second ring structure or the third ring structure is removed.

FIG. 2 is a top view illustrating an intermediate stage of forming a semiconductor device structure 100 in FIGS. 12 and 13, in accordance with some embodiments. FIG. 3 is a cross-sectional view illustrating an intermediate stage of forming the semiconductor device structure 100, taken along a sectional line I-I′ in FIG. 2, in accordance with some embodiments.

As shown in FIGS. 2 and 3, pillars 103 a and 103 b are formed over a substrate 101. In some embodiments, the pillars 103 a and 103 b are circular in the top view of FIG. 2, the pillar 103 a has a center C_(a), and the pillar 103 b has a center C_(b). The cross-sectional view of FIG. 3 is along the sectional line I-I′ of FIG. 2, and the sectional line I-I′ passes through the centers C_(a) and C_(b). Moreover, the pillar 103 a has a width W_(a), the pillar 103 b has a width W_(b), and the pillar 103 a and the pillar 103 b are separated by a distance d₁, as shown in FIG. 3 in accordance with some embodiments.

In some embodiments, the substrate 101 is made of silicon. Alternatively, the substrate 101 may include other elementary semiconductor materials such as germanium (Ge). In some embodiments, the substrate 101 is made of a compound semiconductor such as silicon carbide, gallium nitride, gallium arsenic, indium arsenide, or indium phosphide. In some embodiments, the substrate 101 is made of an alloy semiconductor such as silicon germanium, silicon germanium carbide, gallium arsenic phosphide, or gallium indium phosphide. In some embodiments, the substrate 101 includes a semiconductor-on-insulator substrate, such as a silicon-on-insulator (SOI) substrate, a silicon germanium-on-insulator (SGOI) substrate, or a germanium-on-insulator (GOI) substrate. Semiconductor-on-insulator substrates can be fabricated using separation by implantation of oxygen (SIMOX), wafer bonding, and/or by other suitable methods. In some embodiments, the substrate 101 includes various material layers (e.g., dielectric layers, semiconductor layers, and/or conductive layers) configured to form integrated circuit (IC) features (e.g., doped regions/features, isolation features, gate features, source/drain features (including epitaxial source/drain features), interconnect features, other features, or combinations thereof).

Moreover, the pillars 103 a and 103 b are made of dielectric materials, in accordance with some embodiments. In some embodiments, the pillars 103 a and 103 b include silicon oxide, silicon nitride, silicon carbide, silicon oxynitride, silicon oxycarbide (SiOC), silicon carbonitride (SiCN), silicon oxide carbonitride (SiOCN), another applicable material, or a combination thereof.

In addition, the pillars 103 a and 103 b are formed by a deposition process and a patterning process. For example, a material layer (not shown) may be deposited over the substrate 101, and the material layer may be patterned to form pillars 103 a and 103 b over the substrate 101. The deposition process may include a chemical vapor deposition (CVD) process, a physical vapor deposition (PVD) process, an atomic layer deposition (ALD) process, a spin-on process, another applicable process, or a combination thereof.

In some embodiments, the patterning process includes a photolithography process and a subsequent etching process. The photolithography process may form photoresist patterns (not shown) on a top surface of the material layer. The photolithography process may include photoresist coating (e.g., spin-on coating), soft baking, mask aligning, exposure, post-exposure baking, developing the photoresist, rinsing and drying (e.g., hard baking). In some embodiments, the etching process is a dry etching process, a wet etching process, or a combination thereof.

It should be noted that the width W_(a) is substantially the same as the width W_(b), and the proportion of the width W_(a) to the distance d₁ is approximately three to five, in accordance with some embodiments. Within the context of this disclosure, the word “substantially” means preferably at least 90%, more preferably 95%, even more preferably 98%, and most preferably 99%. In addition, although the pillars 103 a and 103 b are circular in the top view of FIG. 2, the scope of the disclosure is not intended to be limiting. For example, in other embodiments, the pillars 103 a and 103 b may have other shapes in the top view.

FIG. 4 is a top view illustrating an intermediate stage of forming the semiconductor device structure 100 in FIGS. 12 and 13, in accordance with some embodiments. FIG. 5 is a cross-sectional view illustrating an intermediate stage of forming the semiconductor device structure 100, taken along a sectional line I-I′ in FIG. 4, in accordance with some embodiments.

As shown in FIGS. 4 and 5, first ring structures 105 a and 105 b are formed surrounding the pillars 103 a and 103 b. More specifically, sidewalls of the pillar 103 a are entirely surrounded and in direct contact with the first ring structure 105 a, and sidewalls of the pillar 103 b are entirely surrounded and in direct contact with the first ring structure 105 b, in accordance with some embodiments. In other words, sidewalls of the pillar 103 a have no portion not covered by the first ring structure 105 a, and sidewalls of the pillar 103 a have no portion not covered by the first ring structure 105 b.

Some materials and processes used to form the first ring structures 105 a and 105 b are similar to those used to form the pillars 103 a and 103 b and are not repeated herein. However, it should be noted that the materials of the pillars 103 a and 103 b are different from the materials of the first ring structures 105 a and 105 b.

The first ring structure 105 a has a width W_(1a), the first ring structure 105 b has a width W_(1b), and the first ring structure 105 a and the first ring structure 105 b are separated a distance d₂, as shown in FIG. 5 in accordance with some embodiments. In some embodiments, the width W_(1a) is substantially the same as the width W_(1b), the distance d₂ is substantially the same as the width W_(a), and the proportion of the width W_(1a) to the distance d₂ is approximately one to three, in accordance with some embodiments.

FIG. 6 is a top view illustrating an intermediate stage of forming the semiconductor device structure 100 in FIGS. 12 and 13, in accordance with some embodiments. FIG. 7 is a cross-sectional view illustrating an intermediate stage of forming the semiconductor device structure 100, taken along a sectional line I-I′ in FIG. 6, in accordance with some embodiments.

As shown in FIGS. 6 and 7, the pillars 103 a and 103 b are removed to form openings 110 a and 110 b. In some embodiments, the pillar 103 a is removed to form the opening 110 a, such that the opening 110 a is entirely surrounded by the first ring structure 105 a, and the pillar 103 b is removed to form the opening 110 b, such that the opening 110 b is entirely surrounded by the first ring structure 105 b. In some embodiments, the top surface of the substrate 101 is exposed by the openings 110 a and 110 b.

In some embodiments, the pillars 103 a and 103 b are removed by an etching process, such as a dry etching process. As described above, the materials of the pillars 103 a and 103 b are different from the materials of the first ring structures 105 a and 105 b, and the materials of the pillars 103 a, 103 b and the first ring structures 105 a, 105 b are selected such that the etching selectivity of the pillars 103 a and 103 b with respect to the first ring structures 105 a and 105 b is high. Therefore, the pillars 103 a and 103 b are removed by the etching process while the first ring structures 105 a and 105 b may be substantially left in place, and the openings 110 a and 110 b are obtained.

FIG. 8 is a top view illustrating an intermediate stage of forming the semiconductor device structure 100 in FIGS. 12 and 13, in accordance with some embodiments. FIG. 9 is a cross-sectional view illustrating an intermediate stage of forming the semiconductor device structure 100, taken along a sectional line I-I′ in FIG. 8, in accordance with some embodiments.

As shown in FIGS. 8 and 9, a dielectric layer 111 is formed over the top surfaces of the first ring structures 105 a and 105 b, and over the top surface of the substrate 101. More specifically, the bottom surfaces of the openings 110 a and 110 b are covered by the dielectric layer 111, such that reduced openings 110 a′ and 110 b′ are formed.

Some materials and processes used to form the dielectric layer 111 are similar to, or the same as, those used to form the pillars 103 a and 103 b and are not repeated herein. In some embodiments, the materials of the dielectric layer 111 are different from the materials of the first ring structures 105 a and 105 b. In some embodiments, the dielectric layer 111 is formed by selectively growing or depositing a dielectric material over the top surfaces of the first ring structures 105 a and 105 b, and over the top surface of the substrate 101, leaving sidewalls of the first ring structures 105 a and 105 b partially exposed. That is, a portion of the sidewalls of the first ring structures 105 a and 105 b are not covered by the dielectric layer 111. In some embodiments, the dielectric layer 111 is formed by an epitaxial (epi) process.

FIG. 10 is a top view illustrating an intermediate stage of forming the semiconductor device structure 100 in FIGS. 12 and 13, in accordance with some embodiments. FIG. 11 is a cross-sectional view illustrating an intermediate stage of forming the semiconductor device structure 100, taken along a sectional line I-I′ in FIG. 10, in accordance with some embodiments.

As shown in FIGS. 10 and 11, second ring structures 113 a ₁ and 113 b ₁ are formed over inner sidewalls of the first ring structures 105 a and 105 b, and third ring structures 113 a ₂ and 113 b ₂ are formed over outer sidewalls of the first ring structures 105 a and 105 b. In some embodiments, the first ring structure 105 a is sandwiched between and in direct contact with the second ring structure 113 a ₁ and the third ring structure 113 a ₂, and the first ring structure 105 b is sandwiched between and in direct contact with the second ring structure 113 b ₁ and the third ring structure 113 b ₂.

Moreover, the reduced openings 110 a′ and 110 b′ are not entirely filled by the second ring structures 113 a ₁ and 113 b ₁, resulting in the formation of openings 120 a and 120 b. In particular, the top surface of the dielectric layer 111 is partially exposed by the openings 120 a and 120 b. Specifically, the opening 120 a is surrounded by the second ring structure 113 a ₁, and the opening 120 b is surrounded by the second ring structure 113 b ₁. The top surface of the dielectric layer 111 over each of the first ring structures 105 a and 105 b is higher than the top surfaces of the second ring structures 113 a ₁, 113 b ₁, and higher than the top surfaces of the third ring structures 113 a ₂ and 113 b ₂.

Some materials and processes used to form the second ring structures 113 a ₁ and 113 b ₁ and the third ring structures 113 a ₂ and 113 b ₂ are similar to, or the same as, those used to form the pillars 103 a and 103 b and are not repeated herein. However, it should be noted that the materials of the second ring structures 113 a ₁ and 113 b ₁ and the third ring structures 113 a ₂ and 113 b ₂ are different from the materials of the dielectric layer 111 and the materials of the first ring structures 105 a and 105 b, in accordance with some embodiments.

In some embodiments, the second ring structures 113 a ₁, 113 b ₁ and the third ring structures 113 a ₂, 113 b ₂ are formed during the same process step. In some embodiments, the second ring structures 113 a ₁, 113 b ₁ and the third ring structures 113 a ₂, 113 b ₂ are simultaneously formed, and are made of the same material.

Moreover, the second ring structure 113 a ₁ has a width W_(2a), the second ring structure 113 b ₁ has a width W_(2b), the third ring structure 113 a ₂ has a width W_(3a), the third ring structure 113 b ₂ has a width W_(3b), the opening 120 a has a width W_(4a), the opening 120 b has a width W_(4b), and the third ring structure 113 a ₂ and the third ring structure 113 b ₂ are separated by a distance d₃, as shown in FIG. 11 in accordance with some embodiments. In some embodiments, the widths W_(1a), W_(1b), W_(2a), W_(2b), W_(3a), W_(3b), W_(4a), W_(4b), and the distance d₃ are substantially the same.

FIG. 12 is a top view illustrating the semiconductor device structure 100, in accordance with some embodiments. FIG. 13 is a cross-sectional view illustrating the semiconductor device structure 100, taken along a sectional line I-I′ in FIG. 12, in accordance with some embodiments.

As shown in FIGS. 12 and 13, the first ring structures 105 a and 105 b, and a portion of the dielectric layer 111 are removed. In particular, a portion of the dielectric layer 111 not covered by the second ring structures 113 a ₁, 113 b ₁ or the third ring structures 113 a ₂, 113 b ₂ is removed.

More specifically, a portion of the dielectric layer 111 over the top surface of the first ring structures 105 a and 105 b, and a portion of the dielectric layer 111 over the top surface of the substrate 101 and not covered by the second ring structures 113 a ₁, 113 b ₁ or the third ring structures 113 a ₂, 113 b ₂ are removed by an etching process. In some embodiments, the etching process is performed by using the second ring structures 113 a ₁, 113 b ₁ and the third ring structures 113 a ₂, 113 b ₂ as a mask. The etching process includes a dry etching process, a wet etching process, or a combination thereof, in accordance with some embodiments.

As described above, the materials of the second ring structures 113 a ₁ and 113 b ₁ and the third ring structures 113 a ₂ and 113 b ₂ are different from the materials of the dielectric layer 111 and the materials of the first ring structures 105 a and 105 b, and the materials of the first ring structures 105 a, 105 b, the dielectric layer 111, the second ring structures 113 a ₁, 113 b ₁, and the third ring structures 113 a ₂, 113 b ₂ are selected such that the etching selectivities of the dielectric layer 111 and the first ring structures 105 a, 105 b with respect to the second ring structures 113 a ₁, 113 b ₁, and the third ring structures 113 a ₂, 113 b ₂ are high. Therefore, the first ring structures 105 a, 105 b and a portion of the dielectric layer 111 are removed by the etching process while the second ring structures 113 a ₁, 113 b ₁ and the third ring structures 113 a ₂, 113 b ₂ may be substantially left intact.

When the dielectric layer 111 is partially removed, the openings 120 a and 120 b are deepened such that openings 120 a′ and 120 b′ are obtained. In some embodiments, the opening 120 a′ is entirely surrounded by the second ring structure 113 a ₁, and the opening 120 b′ is entirely surrounded by the second ring structure 113 b ₁. Moreover, a gap 130 a is formed between the second ring structure 113 a ₁ and the third ring structure 113 a ₂, and a gap 130 b is formed between the second ring structure 113 b ₁ and the third ring structure 113 b ₂. In addition, the top surface of the substrate 101 is partially exposed by the gaps 130 a, 130 b and the openings 120 a′, 120 b′, in accordance with some embodiments.

In some embodiments, the width W_(4a) of the openings 120 a′, the width W_(2a) of the second ring structure 113 a ₁, the width W_(1a) of the gap 130 a, the width W_(3a) of the third ring structure 113 a ₂, the distance d₃ between the third ring structures 113 a ₂ and 113 b ₂, the width W_(3b) of the third ring structure 113 b ₂, the width W_(1b) of the gap 130 b, the width W_(2b) of the second ring structure 113 b ₁, and the width W_(4b) of the openings 120 b′ are substantially the same. As a result, the semiconductor device structure 100 is obtained with two concentric double ring structures (i.e., the center C_(a) is the common center of the second ring structure 113 a ₁ and the third ring structure 113 a ₂, and the center C_(b) is the common center of the second ring structure 113 b ₁ and the third ring structure 113 b ₂) in the top view of FIG. 12.

It should be noted that, although only two concentric double ring structures are illustrated in FIG. 12, the present disclosure is not limited thereto. Depending on the product demands, the number of concentric double ring structures in the semiconductor device structure 100 may be one or more than two. Furthermore, the concentric double ring structures can have other shapes in the top view, and each of the concentric ring structures can have more than two rings, such as concentric triple ring structures.

Embodiments of a semiconductor device structure and a method for forming the same are provided. The method for forming the semiconductor device structure 100 includes forming the pillars 103 a, 103 b over the substrate 101, and the pillars 130 a, 103 b are separated by a distance d₁. The method also includes forming the first ring structures 105 a, 105 b surrounding the pillars 103 a, 103 b, removing the pillars 103 a, 103 b, forming the second ring structures 113 a ₁, 113 b ₁ over the inner sidewalls of the first ring structures 105 a, 105 b, and forming the third ring structures 113 a ₂, 113 b ₂ over the outer sidewalls of the first ring structures 105 a, 105 b. The method further includes removing the first ring structures 105 a, 105 b to form gaps 130 a, 130 b between the second ring structures 113 a ₁, 113 b ₁ and the third ring structures 113 a ₂, 113 b ₂.

The widths W_(1a), W_(1b) of the gaps 130 a, 130 b, the widths W_(4a), W_(4b) of the openings 120 a′, 120 b′ surrounded by the second ring structures 113 a ₁, 113 b ₁, and the distance d₃ between the third ring structures 113 a ₂, 113 b ₂ are substantially the same, and are smaller than the distance d₁ between the pillars 103 a, 103 b. The widths W_(2a), W_(2b) of the second ring structures 113 a ₁, 113 b ₁, and the widths W_(3a), W_(3b) of the third ring structures 113 a ₂, 113 b ₂ are substantially the same, and are smaller than the widths W_(a), W_(b) of the pillars 103 a, 103 b. Therefore, the semiconductor device structure 100 having a finer pattern (with reduced pitch of patterns compared to the pattern of the pillars 103 a, 103 b) can be obtained.

Moreover, since a finer pattern with relatively smaller critical dimension can be obtained by the aforementioned method for forming the semiconductor device structure 100, the limitation in the resolution of the exposure apparatus can be overcome, and semiconductor fabrication may be achieved without requiring the use of high-priced semiconductor fabrication equipment.

FIG. 14 is a top view illustrating a semiconductor device structure 200, in accordance with some embodiments.

In some embodiments, the two concentric double ring structures can be rectangles with rounded corners in the top view. In particular, the two concentric double ring structures can be squares with rounded corners in the top view, as shown in FIG. 14 in accordance with some embodiments. In these cases, the second ring structure 113 a ₁ and the third ring structure 113 a ₂ have point symmetry about the center C_(a), and the second ring structure 113 b ₁ and the third ring structure 113 b ₂ have point symmetry about the center C_(b). In addition, FIG. 13 is taken along a sectional line I-I′ in FIG. 14, in accordance with some embodiments, and the sectional line I-I′ passes through the centers C_(a) and C_(b).

In one embodiment of the present disclosure, a method for forming a semiconductor device structure is provided. The method includes forming a pillar over a substrate, and forming a first ring structure over a sidewall of the pillar. The method also includes removing the pillar to form a first opening surrounded by the first ring structure, and forming a second ring structure in the first opening. The method further includes forming a third ring structure surrounding the first ring structure after the first opening is formed, and removing the first ring structure to form a gap between the second ring structure and the third ring structure.

In another embodiment of the present disclosure, a method for forming a semiconductor device structure is provided. The method includes forming a first pillar over a substrate, and forming a first ring structure surrounding the first pillar. A width of the first pillar is greater than a width of the first ring structure. The method also includes removing the first pillar after the first ring structure is formed, and forming a dielectric layer over a top surface of the substrate after the first pillar is removed. The method further includes forming a second ring structure and a third ring structure over the dielectric layer. The second ring structure is surrounded by the first ring structure, and the second ring structure is surrounded by the third ring structure. In addition, the method includes removing the first ring structure and a portion of the dielectric layer not covered by the second ring structure or the third ring structure.

In one embodiment of the present disclosure, a semiconductor device structure is provided. The semiconductor device structure includes a substrate, and a dielectric layer disposed over the substrate. The semiconductor device structure also includes a first ring structure disposed over the dielectric layer, and a second ring structure disposed over the dielectric layer and surrounding the first ring structure. The first ring structure and the second ring structure have a first common center. The first opening surrounded by the first ring structure has a width in a cross-sectional view, and the width is substantially the same as a distance between the first ring structure and the second ring structure in the cross-sectional view.

Although the present disclosure and its advantages have been described in detail, it should be understood that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the disclosure as defined by the appended claims. For example, many of the processes discussed above can be implemented in different methodologies and replaced by other processes, or a combination thereof.

Moreover, the scope of the present application is not intended to be limited to the particular embodiments of the process, machine, manufacture, composition of matter, means, methods and steps described in the specification. As one of ordinary skill in the art will readily appreciate from the present disclosure, processes, machines, manufacture, compositions of matter, means, methods, or steps, presently existing or later to be developed, that perform substantially the same function or achieve substantially the same result as the corresponding embodiments described herein may be utilized according to the present disclosure. Accordingly, the appended claims are intended to include within their scope such processes, machines, manufacture, compositions of matter, means, methods, and steps. 

1. A method for forming a semiconductor device structure, comprising: forming a pillar over a substrate; forming a first ring structure over a sidewall of the pillar; removing the pillar to form a first opening surrounded by the first ring structure; forming a dielectric layer over a top surface of the substrate and a top surface of the first ring structure; forming a second ring structure in the first opening; forming a third ring structure surrounding the first ring structure after the first opening is formed; and removing the first ring structure to form a gap between the second ring structure and the third ring structure; wherein a top surface of the dielectric layer is higher than top surfaces of the second ring structure and the third ring structure before the first ring structure is removed.
 2. The method for forming a semiconductor device structure of claim 1, wherein the first ring structure is in direct contact with the second ring structure, and a width of the first ring structure is substantially the same as a width of the second ring structure.
 3. The method for forming a semiconductor device structure of claim 1, wherein the first ring structure is in direct contact with the third ring structure, the second ring structure and the third ring structure are simultaneously formed, and a width of the second ring structure is substantially the same as a width of the third ring structure.
 4. The method for forming a semiconductor device structure of claim 1, wherein a width of the pillar is greater than about three times a width of the first ring structure.
 5. (canceled)
 6. The method for forming a semiconductor device structure of claim 1, wherein the second ring structure and the third ring structure are formed over the dielectric layer, and a material of the dielectric layer is different from a material of the second ring structure and a material of the third ring structure.
 7. The method for forming a semiconductor device structure of claim 1, wherein a second opening is formed in the first opening after the second ring structure is formed, the second opening is surrounded by the second ring structure, and a width of the first ring structure is substantially the same as a width of the second opening.
 8. A method for forming a semiconductor device structure, comprising: forming a first pillar over a substrate; forming a first ring structure surrounding the first pillar, wherein a width of the first pillar is greater than a width of the first ring structure; removing the first pillar after the first ring structure is formed; forming a dielectric layer over a top surface of the substrate after the first pillar is removed; forming a second ring structure and a third ring structure over the dielectric layer, wherein the second ring structure is surrounded by the first ring structure, and the second ring structure is surrounded by the third ring structure; and removing the first ring structure and a portion of the dielectric layer left uncovered by the second ring structure and the third ring structure.
 9. The method for forming a semiconductor device structure of claim 8, wherein a portion of the dielectric layer is formed over the first ring structure, and a top surface of the portion of the dielectric layer is higher than a top surface of the second ring structure and a top surface of the third ring structure.
 10. The method for forming a semiconductor device structure of claim 8, wherein the second ring structure is in direct contact with an inner sidewall of the first ring structure, and the third ring structure is in direct contact with an outer sidewall of the first ring structure.
 11. The method for forming a semiconductor device structure of claim 8, wherein the second ring structure and the third ring structure are separated by substantially the same distance.
 12. The method for forming a semiconductor device structure of claim 8, wherein bottom surfaces of the second ring structure and the third ring structure are higher than a bottom surface of the first ring structure.
 13. The method for forming a semiconductor device structure of claim 8, further comprising: forming a second pillar over the substrate; forming a fourth ring structure surrounding the second pillar; removing the second pillar; and forming a fifth ring structure lining an inner wall of the fourth ring structure and a sixth ring structure surrounding the fourth ring structure, wherein a distance between the third ring structure and the sixth ring structure is substantially the same as a width of the first ring structure and a width of the third ring structure. 14-20. (canceled) 